1. product profile 1.1 general description n-channel enhancement mode field-effect transistor (fet) in a small sot23 (to-236ab) surface-mounted device (smd) plastic package using trench mosfet technology. 1.2 features and benefits ? logic-level compatible ? very fast switching ? trench mosfet technology 1.3 applications ? relay driver ? high-speed line driver ? low-side loadswitch ? switching circuits 1.4 quick reference data [1] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated, mounting pad for drain 6 cm 2 . PMV22EN 30 v, 5.2 a n-channel trench mosfet rev. 1 ? 30 march 2011 product data sheet table 1. quick reference data symbol parameter conditions min typ max unit v ds drain-source voltage t amb =25c --30v v gs gate-source voltage -20 - 20 v i d drain current v gs =10v; t amb =25c [1] --5.2a static characteristics r dson drain-source on-state resistance v gs =10v; i d = 5.2 a; pulsed; t p 300 s; ? 0.01; t j =25c - 1722m ? product specification sales@twtysemi.com 1 of 4 http://www.twtysemi.com
PMV22EN 30 v, 5.2 a n-channel trench mosfet 2. pinning information 3. ordering information 4. limiting values [1] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated, mounting pad for drain 6 cm 2 . [2] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated and standard footprint. table 2. pinning information pin symbol description simplified outline graphic symbol 1 g gate sot23 (to-236ab) 2ssource 3 d drain 12 3 s d g mbb076 table 3. ordering information type number package name description version PMV22EN to-236ab plastic surface-mounted package; 3 leads sot23 table 4. limiting values in accordance with the absolute maxi mum rating system (iec 60134). symbol parameter conditions min max unit v ds drain-source voltage t amb =25c - 30 v v gs gate-source voltage -20 20 v i d drain current v gs =10v; t amb =25c [1] -5.2a v gs =10v; t amb = 100 c [1] -3.3a i dm peak drain current t amb = 25 c; single pulse; t p 10 s - 20 a p tot total power dissipation t amb =25c [2] - 510 mw [1] - 930 mw t sp = 25 c - 4170 mw t j junction temperature - 150 c t amb ambient temperature -55 150 c t stg storage temperature -65 150 c source-drain diode i s source current t amb =25c [1] - 930 ma product specification sales@twtysemi.com 2 of 4 http://www.twtysemi.com
PMV22EN 30 v, 5.2 a n-channel trench mosfet 5. thermal characteristics [1] device mounted on an fr4 pcb, single-sided copper, tin-plated and standard footprint. [2] device mounted on an fr4 pcb, single-sided c opper, tin-plated, mounting pad for drain 6 cm 2 . table 5. thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air [1] - 207 245 k/w [2] - 116 135 k/w r th(j-sp) thermal resistance from junction to solder point - 2030k/w product specification sales@twtysemi.com 3 of 4 http://www.twtysemi.com
PMV22EN 30 v, 5.2 a n-channel trench mosfet 6. characteristics table 6. characteristics symbol parameter conditions min typ max unit static characteristics v (br)dss drain-source breakdown voltage i d =250a; v gs =0v; t j =25c 30--v v gsth gate-source threshold voltage i d =250a; v ds =v gs ; t j =25c 1 1.5 2.5 v i dss drain leakage current v ds =30v; v gs =0v; t amb =25c --1a v ds =30v; v gs =0v; t amb = 150 c - - 10 a i gss gate leakage current v gs =20v; v ds =0v; t j = 25 c - - 100 na v gs =-20v; v ds =0v; t j = 25 c - - 100 na r dson drain-source on-state resistance v gs =10v; i d = 5.2 a; pulsed; t p 300 s; ? 0.01; t j =25c - 1722m ? v gs =10v; i d = 5.2 a; pulsed; t p 300 s; ? 0.01; t j =150c - 2734m ? v gs =4.5v; i d = 4.5 a; pulsed; t p 300 s; ? 0.01; t j =25c - 2229m ? g fs forward transconductance v ds =5v; i d = 3 a; pulsed; t p 300 s; ? 0.01; t j =25c -12-s dynamic characteristics q g(tot) total gate charge i d =3a; v ds =15v; v gs =10v; t j =25c - 8.6 13 nc q gs gate-source charge - 1.2 - nc q gd gate-drain charge - 1.3 - nc c iss input capacitance v gs =0v; v ds =15v; f=1mhz; t j =25c - 480 - pf c oss output capacitance - 110 - pf c rss reverse transfer capacitance -52-pf t d(on) turn-on delay time v ds =15v; v gs =10v; r g(ext) =6 ? ; t j =25c; i d =3a -4-ns t r rise time - 15 - ns t d(off) turn-off delay time - 100 - ns t f fall time - 40 - ns source-drain diode v sd source-drain voltage i s = 0.93 a; v gs =0v; t j = 25 c - 0.72 1.2 v product specification sales@twtysemi.com 4 of 4 http://www.twtysemi.com
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